High Voltage with Flexible Termination (HV FT-CAP) surface mount MLCCs in X7R dielectric address the primary failure mode of MLCCs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Featuring several of the highest CV (capacitance/voltage) values available in the industry, these devices utilize a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Combined with the stability of an X7R dielectric and designed to accommodate all capacitance requirements, these flex-robust devices are RoHS-compliant, offer up to 5 mm of flex-bend capability and exhibits a predictable change in capacitance with respect to time and voltage. Capacitance change with reference to ambient temperature is limited to ±15% from -55°C to +125°C.