FX11LA-80P/8-SV(92) by Hirose Electric | Stacking Board Connectors | Avnet EMEA
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FX11LA-80P/8-SV(92)

Hirose Electric

Conn Board to Board HDR 80Signal/8Ground POS 0.5mm Solder ST SMD Embossed T/R

Manufacturer Part #: FX11LA-80P/8-SV(92)

Alternate Part #: FX11LA-80P/8-SV(92)


RoHS Compliant NCNR

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Information

Conn Board to Board HDR 80Signal/8Ground POS 0.5mm Solder ST SMD Embossed T/R

Key Features

  • Low Profile Design
    • The board to board mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs
  • Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle
  • 10 Signal
    • 1 Ground Arrangement Signal and ground are arranged in a ratio of 10
    • 1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. Metal Fittings for Added Solder Weld Strength
    • Metal fittings provide greater adhesion to the board,protecting against peeling. The unique connector design provides a connection between the fitting and the ground plate for a stronger ground
  • Suited to High-Density Applications
    • The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting. Structure Prevents Solder Wicking solder gap has been designed into the contact SMT portion to prevent solder wicking
  • High contact reliability
    • Effective mating length is 0.55mm (2mm height),1mm(2.5mm, 3mm height) for signal contacts
  • Optional Ground Plate
    • An alternate style without the ground plate is available.Thespace provided by the ground plate removal has been filled with additional signal contacts.

Technical Attributes

Description
Value
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Operating Temperature
-55 to 85 °C
Product Dimensions
28.6 x 5.05 x 1.9
Maximum Voltage Rating
50 Vac
Termination Method
Solder
Product Length
28.6 mm
Gender
HDR
Mounting
Surface Mount
Body Orientation
Straight
Pitch
0.5 mm
Type
Board to Board
Number of Rows
2
Housing Color
Beige
Housing Material
Liquid Crystal Polymer
Contact Material
Copper Alloy
Lead Finish
Gold Over Nickel
Maximum Contact Resistance
60 mOhm
Maximum Current Rating
0.3 A
Pin Count
88
Max Processing Temp
250
Contact Plating
Gold Over Nickel

ECCN / UNSPSC

Description
Value
ECCN:
EAR99
UNSPSC:
39121400
UNSPSC VERSION:
V15.1101
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