The sub-miniature sockets are designed to allow I.C. devices to be mounted onto printed circuit boards, giving virtually zero above-board profile. The added advantage is of allowing tracks to be taken between the sockets, spaced on 2.54mm pitch centers. The socket is a press fit into a Ø1mm hole, and has a closed body design to eliminate solder wicking. The socket consists of an outer brass shell, with tapered entry for I.C. leads, and an inner spring contact. This contact is manufactured from beryllium copper with four contact fingers. Both shell and spring contact have a choice of gold or tin finish with nickel undercoat. This high reliability socket is designed to meet severe environmental conditions of shock, vibration, bump,etc. It is intended for applications where space is limited.