Multilayer products are truly miniature components and have connecting surfaces that solder directly to the solder lands on a substrate. The multilayer electrode and terminations are made of silver to ensure high electrical conductivity. The electrode is embedded in a ferrite monolithic structure, which provides a good magnetic shielding and makes it very appropriate for high density mounting.
Monolithic structure for closed magnetic path and high reliability
Standard EIA and eiaJ sizes: 0402, 0603, 0805, 1206, 1210, 1806, 1812
This multilayer chip suppressor results in magnetic shielding: the absence of leakage flux makes it most suitable for high density mounting