DS90CP22MT/NOPB by Texas Instruments | APACDigital Crosspoint | Avnet ASIA

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信息

DS90CP22MT/NOPB

Texas Instruments

Digital Crosspoint Single 2x2 0.8Gbps 2:1 Mux/1:2 Demux Switch 16-Pin TSSOP Rail

製造商產品編號: DS90CP22MT/NOPB

替代料號: DS90CP22MT/NOPB


legend 通過RoHS認證

描述

文檔

替代/替換

資料

DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, high speed operation. Data paths are fully differential from input to output for low noise generation and low pulse width distortion. The non-blocking design allows connection of any input to any output or outputs. LVDS I/O enable high speed data transmission for point-to-point interconnects. This device can be used as a high speed differential crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter. The mux and demux functions are useful for switching between primary and backup circuits in fault tolerant systems. The 1:2 signal splitter and 2:1 mux functions are useful for distribution of serial bus across several rack-mounted backplanes.

The DS90CP22 accepts LVDS signal levels, LVPECL levels directly or PECL with attenuation networks.

The individual LVDS outputs can be put into TRI-STATE by use of the enable pins.

 

技術參數

  • DC - 800 Mbps Low Jitter, Low Skew Operation
  • 65 ps (typ) of Pk-Pk Jitter with PRBS = 223−1 Data Pattern at 800 Mbps
  • Single +3.3 V Supply
  • Less than 330 mW (typ) Total Power Dissipation
  • Non-Blocking "'Switch Architecture"'
  • Balanced Output Impedance
  • Output Channel-to-Channel Skew is 35 ps (typ)
  • Configurable as 2:1 mux, 1:2 demux, Repeater or 1:2 Signal Splitter
  • LVDS Receiver Inputs Accept LVPECL Signals
  • Fast Switch Time of 1.2ns (typ)
  • Fast Propagation Delay of 1.3ns (typ)
  • Receiver Input Threshold < ±100 mV
  • Available in 16 Lead TSSOP and SOIC Packages
  • Conforms to ANSI/TIA/EIA-644-1995 LVDS Standard
  • Operating Temperature: −40°C to +85°C
  • 技術屬性

    描述
    尋找類似物料
    Lead Finish
    Matte Tin
    Minimum Single Supply Voltage
    3 V
    Mounting
    Surface Mount
    Maximum Data Rate
    0.8 Gbps
    Array Configuration
    2x2
    Differential Data Transmission
    Yes
    Operating Temperature
    -40 to 85 °C
    Number of Arrays
    1
    Maximum Single Supply Voltage
    3.6 V
    Supplier Package
    TSSOP
    Input Level
    LVPECL
    Power Supply Type
    Single
    Pin Count
    16
    Output Level
    LVDS
    Max Processing Temp
    260
    Product Dimensions
    5 x 4.4 x 0.9 mm
    MSL Level
    1

    ECCN/UNSPSC

    描述
    ECCN:
    EAR99
    計劃交貨期 B:
    8471.50.0150
    HTSN:
    8471.50.0150
    UNSPSC:
    32101620
    UNSPSC VERSION:
    V15.1101
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