The Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance beckplane interconnect system.
The Z-PACK TinMan connector design follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single pin levels.
Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is provided with a dual point of contact mating interface and compliant pin interface to the printed circuit board.
10+ Gbps performance
100 ohm Impedance for Differential Pair configuration
5 pair version offers 26 pairs/10mm (66 differential pairs/inch) fitting within a 25.40 [1.00] card slot pitch
Vertical headers (coplanar) in 5 pair
Reliable, redundant contact design on every, signal contact
Modular system offered in various column versions
Meets Industry reliability requirements or Bellcore/Telcordia