Res Thick Film 2010 3.9K Ohm 5% 1W ±100ppm/°C Molded SMD SMD T/R
Vishay Sfernice thick film resistor chips are specially designed to meet very stringent specifications in terms of reliability, stability < 0.25 % at Pn at + 70 °C during 1000 h, homogeneity, reproducibility and quality. They conform to specifications NFC 83-240 and MIL-R-55342 D.
Evaluated to ESCC 4001/026. Sputtered Thin Film terminations, with nickel barrier, are very convenient for high operating conditions. They can withstand thousands of very severe thermal shocks. B (W/A), N (W/A), and F (one face) types are for solder reflow assembly.
G (W/A) and W (one face) types are for wire bonding, gluing and even high temperature solder reflow.