These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The 'LVT244 is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT244 is packaged in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT244is characterized for operationfrom -40°C to 85°C.
State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation Down to 2.7 V
Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
Supports Live Insertion
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flatpacks (W), and Ceramic DIPS (J)