Surface mount LGA socket is designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever mechanism (ILM) generates the Z-axis compression load. A robust bolster plate helps eliminate PCB bowing during compression. The sockets are validated to Intel Design Guides.
LGA 1366 Socket
1366 contacts with a 1.016mm x 1.016mm grid
Available with 15 Gold contact plating
Socket housing facilitates efficient soldering to the PCB board
Socket is supplied with a cap to facilitate vacuum pick and place
Two backplate options for use in desktop or server applications