This dual buffer/line driver is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The SN74LVC2G241 device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking or the current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Available in the Texas Instruments NanoFree Package
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 4.1 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCC Level
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II