5-147121-1 by TE Connectivity | 连接器头和PCB插座 | Avnet ASIA
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5-147121-1

TE Connectivity

Conn Shrouded Header HDR 10 POS 1.27mm Solder ST Thru-Hole T/R

Manufacturer Part #: 5-147121-1

Alternate Part #: 5-147121-1


legend RoHS Compliant

Descriptions

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Subs/Alternatives

Information

AMPMODU 50/50 Grid Vertical Headers and Receptacles are designed for parallel board-to-board stacking in high density applications.

Right-angle board-to-board and cable-to-board applications are also possible, since the vertical receptacles also mate with non-latching right-angle headers and the vertical headers also mate with non-latching cable connectors.

Available are double row, vertical shrouded headers and receptacles in sizes ranging from 10 through 100 positions (in 10 position increments).

Parallel board-to-board stack heights of .250 [6.35], .320 [8.13] and .390 [9.91] are achievable by selection of the appropriate header. The receptacle is the same for all three stack height headers.

Non-protrusive metallic holddowns are designed for use in .062 [1.57] or thicker PC boards and allow surface mounting to both sides of the board. In addition to providing retention during processing, the holddowns are soldered during reflow and therefore provide long-term strain relief for the solder joints.

AMPMODU 50/50 Grid Vertical Headers and Receptacles are designed to be compatible with standard surface-mount processes; IR (infrared) and VPR (vapor phase reflow). The surface-mount connectors have been designed so that dimensioning, tolerances, referenced datums, holddown characteristics and packaging methods result in a system that is compatible with robotic assembly.

The headers and receptacles feature polarization to prevent misalignment.

Key Features

  • Surface-mount products for parallel board-to-board applications, as well as right-angle board-to-board and cable-to-board applications
  • Board-to-Board Vertical Headers, Double Row
  • High density .050 x .050 [1.27x1.27] centerline grid
  • Three board-to-board stack heights: .250 [6.35]
  • Non-protrusive metallic holddowns
  • Reliable dual beam receptacle contacts for redundant contact
  • Duplex plated receptacle and post contacts; gold plated on mating areas, tin plated on tails
  • Compatible with standard surface-mount processing (VPR and IR)
  • Receptacle and header allow for drainage of processing fluids
  • Tape and reel packaging available.
  • Polarized header and receptacle assemblies
  • Sizes of 10 positions
  • Recognized under the Component Program of Underwriters Laboratories Inc.
  • Certified by Canadian Standards Association

Technical Attributes

Description
Value
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Maximum Voltage Rating
30
Number of Contacts
10 POS
Type
Shrouded Header
Number of Rows
2
Pitch
1.27 mm
Housing Material
Liquid Crystal Polymer
Contact Plating
Gold Over Nickel
Housing Color
Black
Termination Method
Solder
Gender
HDR
Operating Temperature
-65 to 105 °C
Mounting
Through Hole
Contact Material
Phosphor Bronze
Body Orientation
Straight
Max Processing Temp
245|260
Maximum Current Rating
4/Contact A
Lead Finish
Tin/Lead
Family
AMPMODU Board-to-Boad & Wire-to-Board Connectors
Product Length
9.44 mm

ECCN / UNSPSC

Description
Value
ECCN:
EAR99
SCHEDULE B:
8536.69.10.00.3
HTSN:
8536.69.10.00.3
UNSPSC:
39121400
UNSPSC VERSION:
V15.1101
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USD    $2.1067

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