Digi ConnectCore® system-on-modules (SOMs) offer a secure, power-efficient platform designed to accelerate embedded development. With integrated security features and wireless connectivity, Digi ConnectCore® SOMs enable rapid development of sophisticated, secure, featured-rich wireless designs.
ConnectCore® Development Kit Sale!
For a limited time, Digi is offering the lowest prices available on the Digi ConnectCore® MP1 Family Development Kits and the Digi ConnectCore® 93 Development Kit. Digi IoT development kits include boards, modules and accessories for rapid prototyping, testing and development of wireless applications. Get started on your next project today!
- Digi ConnectCore® 93
- Digi ConnectCore® MP157
- Digi ConnectCore® MP133
Digi ConnectCore® 93 is a wireless, highly power-efficient and secure system-on-module based on the NXP i.MX 93. It offers flexible connectivity, with dual-band Wi-Fi 6 and Bluetooth® 5.2, and integrates an AI/ML NPU. Digi’s SMTplus® standard form factor (40x45mm) provides outstanding reliability for a wide range of industrial IoT applications.
Features & Benefits:
- Industrial i.MX 93 dual-core embedded SOM platform
- AI/ML Arm Ethos U65 micro neural processing unit (NPU)
- Pre-certified dual-band 802.11ax Wi-Fi 6 and Bluetooth 5.3
- Digi SMTplus® form factor (40 x 45 mm) for ultimate reliability
- Superior power management, hardware and software support
- Seamless cellular modem and Digi XBee® integration
- High level of pin-compatibility with Digi ConnectCore® 8 SOMs
- Built-in Digi TrustFence device security, identity and privacy
- Remote monitoring, device management and IoT application enablement with Digi ConnectCore Cloud Services
- Digi Embedded Yocto Linux support
- Turnkey development services available from Digi WDS
Resources
Digi ConnectCore® 93 Data Sheet | Digi ConnectCore® 93 Development Kit Data Sheet
Digi ConnectCore® MP157 is a compact, wireless, and secure system-on-module based on the STMicroelectronics STM32MP157C MPU. With integrated 802.11ac Wi-Fi and Bluetooth® 5, it offers flexible connectivity. The tiny Digi SMTplus form factor (29x29mm) makes it ideal for handheld devices, with display and 3D graphics support.
Features & Benefits:
- Industrial-grade, scalable, embedded SOM platform
- Pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.0
- 3D GPU, rich display and camera capabilities
- Power management with hardware and software support
- Digi SMTplus form factor (29 x 29 mm) for ultimate reliability
- High level of pin-compatibility with ConnectCore® 6UL SOMs
- Built-in Digi TrustFence device security, identity and privacy
- Seamless cellular modem and Digi XBee® integration
- Digi ConnectCore Cloud Services remote monitoring, device management and IoT application enablement
- Digi Embedded Yocto Linux support
- Turnkey development services available from Digi WDS
Resources
Digi ConnectCore® MP157 Data Sheet | Digi ConnectCore® MP157 Development Kit Data Sheet
Digi ConnectCore® MP133 is a compact, wireless, and secure system-on-module based on the STMicroelectronics STM32MP133C MPU. With integrated 802.11ac Wi-Fi and Bluetooth® 5.2, it offers flexible and reliable connectivity. The tiny Digi SMTplus® form factor (29 x 29 mm) makes it ideal for portable industrial devices and smart IoT gateways.
Features & Benefits:
- Industrial-grade, scalable, embedded SOM platform
- Pre-certified dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2
- Power management with hardware and software support
- Digi SMTplus form factor (29 x 29 mm) for ultimate reliability
- High level of pin-compatibility with ConnectCore 6UL SOMs
- Built-in Digi TrustFence device security, identity and privacy
- Seamless cellular modem and Digi XBee® integration
- Remote monitoring, device management and IoT application enablement with Digi ConnectCore® Cloud Services
- Digi Embedded Yocto Linux support
- Turnkey development services available from Digi WDS
Resources
Digi ConnectCore® MP133 Data Sheet | Digi ConnectCore® MP133 Development Kit Data sheet
