374424B00032G
Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 °C/W, 18 mm, 27 mm, 27 mm
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Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 374424B00032G
Secondary Manufacturer Part#: 043323
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RoHS 10 Compliant -
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Technical Attributes
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| Description | Value |
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ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8473309100 |
| Schedule B: | 8473300002 |
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